Workshop WS1 "Simulation of Advanced Interconnects"

© Fraunhofer IISB

Simulated electrical potential in the vicinity of local DRAM interconnects

© GSS

Simulation of capacitive coupling between adjacent interconnects

© GSS

Simulation of line-edge roughness and metal grain granularity

The workshop will take place on Monday, September 5, 2016 at the SISPAD conference location (Le Meridien Grand Hotel).

The workshop fee is 60 EUR and includes workshop proceedings (printed handout of the slides), lunch, and coffee breaks.

To register for the workshop choose the workshop option "WS1" in the online registration form or just send an e-mail to info@sispad2016.org. You can register for the workshop independent of the registration for the conference.
 

Objectives

The impact of interconnects on circuit performance and reliability is increasing as dimensions shrink down to the several nanometer range. Software modules addressing interconnect issues on different levels therefore gain significant importance. Within the SISPAD 2016 workshop "Simulation of Advanced Interconnect" presentations from industry and research will highlight the most important challenges and will provide insight into capabilities of existing simulation modules for interconnects and into future developments of technology and modeling approaches. Software demonstrations will allow you to gain insight into the different software modules and their interaction.

The workshop is organized by S. Amoroso (Gold Standard Simulations), E. Baer (Fraunhofer IISB), and L. Filipovic (TU Wien) in cooperation with the H2020 projects CONNECT and SUPERAID7.


The workshop will comprise presentations from industry and research:   

8:45 Registration
9:00 Keynote: Status and Future of Advanced Interconnects and the Needs for Simulation O. Faynot, CEA-LETI
9:45 Performance of Doped Carbon Nanotubes Interconnects J. Liang (presenting), A. Todri-Sanial, University of Montpellier
10:30 Challenges and Simulation Solutions for Advanced Lithography for Nanometer Interconnect Patterning P. Evanschitzky, Fraunhofer IISB
11:15 Coffee Break
11:30 Process Simulation Models and their Application to Interconnect Manufacturing E. Baer, Fraunhofer IISB
12:15 Thermal, Electrical, Mechanical, and Reliability Simulation for Interconnects L. Filipovic, TU Wien
13:00 Lunch
14:00 Tools for Simulation Workflow Management and their Application to Interconnect Modeling S. Amoroso, Gold Standard Simulations
14:45 Physical Modeling and Numerical Optimization of the Transient Inductive Behaviour of Busbar Structures in Power Modules V. Basler, G. Wachutka, TU Muenchen
16:00 Live Demonstration of Tools for Interconnect Simulation